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MVPC with MLSHI®
Material Science & Physics are Very Important Integral Part of the Advanced Interface
Size: 70 x 80mm
Thickness: 1.8mm +/- 30µm
Base: 16L HTCC (showing)
16L LTCC
0.5mm Pitch
Top: 8L RDL/TF
Dk (T): 10-25µm
Cu (T): 10-20µm
EF (20µm Via, AR 1.25): >0.98
Impedance Controlled (+/-3%)
LPDP: ~10GBPS
6 DUTS / >32K TP
Pitch: 80µm
Pad Size: 60µm
Clearance 10-20µm
Surface Finish: Ni over Au
HG ~ 1.1µm
(190 Knoop)
Pd (Optional)
Dut Area Flatness: < 3µm
Total Flatness: < 10µm
Total Warpage: < 25µm
Size: 55 x 55mm
Thickness: 2.5mm +/- 30µm
Base: 12L HDI Organic (showing)
0.5mm Pitch
Top: 6L RDL/TF
Dk (T): 10-25µm
Cu (T): 10-20µm
EF (20µm Via, AR 1.25): >0.98
Impedance Controlled (+/-5%)
LPDP: ~20GBPS
4 DUTS / >6K TP
Pitch: 50µm
Pad Size: 40µm
Clearance 9-10µm
Surface Finish: Ni over Au
HG ~ 1.1µm
(190 Knoop)
Pd (Optional)
Dut Area Flatness: < 2µm
Total Flatness: < 10µm
Total Warpage: < 25µm
Size: 45 x 45mm
Thickness: 1.8mm +/- 30µm
Base: 16L HDI Organic (showing)
0.6mm Pitch
Top: 3L RDL/TF
Dk (T): 10-25µm
Cu (T): 10-20µm
EF (20µm Via, AR 1.25): >0.98
Impedance Controlled (+/-5%)
LPDP: ~2GBPS
16 DUTS / >6K TP
Pitch: 67µm
Pad Size: 52µm
Clearance 13-15µm
Surface Finish: Ni over Au
HG ~ 1.1µm
(190 Knoop)
Pd (Optional)
Dut Area Flatness: < 2µm
Total Flatness: < 10µm
Total Warpage: < 25µm
Size: 50 x 50mm
Thickness: 3.5mm +/- 30µm
Base: 24 HDI Organic (showing)
0.65mm Pitch
Top: 6TL+2BL RDL/TF
Dk (T): 10-25µm
Cu (T): 10-20µm
EF (20µm Via, AR 1.25): >0.98
Impedance Controlled (+/-5%)
LPDP: ~8GBPS
6 DUTS / >6K TP
Pitch: 51µm
Pad Size: 41µm
Clearance 8-10µm
Surface Finish: Ni over Au
HG ~ 1.1µm
(190 Knoop)
Pd (Optional)
Dut Area Flatness: < 2µm
Total Flatness: < 10µm
Total Warpage: < 25µm
AVIV Technology Pte. Ltd.
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안녕하세요
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مرحبا
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